AN-MN9 3G 13,8 W/M-K TERMAL MACUN

AN-MN9 IS A THERMAL PASTE DESIGNED TO IMPROVE HEAT TRANSFER BETWEEN HEAT-GENERATING ELECTRONIC COMPONENTS SUCH AS CPUS AND GPUS AND THEIR COOLING SOLUTIONS. WITH A THERMAL CONDUCTIVITY OF 13.8 W/M-K, IT HELPS TRANSFER HEAT EFFECTIVELY FROM THE COMPONENT TO THE COOLER. THE FORMULA ALSO HELPS FILL MICROSCOPIC IMPERFECTIONS BETWEEN THE COMPONENT AND COOLER SURFACES.

SUITABLE FOR COOLING APPLICATIONS INVOLVING SENSITIVE ELECTRONIC COMPONENTS SUCH AS CPUS AND GPUS, AN-MN9 FEATURES A SYRINGE DESIGN FOR CONTROLLED AND PRACTICAL APPLICATION. THE 3G PACKAGE IS SUITABLE FOR THERMAL PASTE REPLACEMENT AND MAINTENANCE ON COMPONENTS SUCH AS PROCESSORS AND GRAPHICS CARDS.

THE PRODUCT CAN BE USED IN DESKTOP COMPUTERS, LAPTOPS, GRAPHICS CARDS AND OTHER COMPATIBLE COOLING SYSTEMS.

⚙️ PRODUCT FEATURES

• MODEL: AN-MN9
• PRODUCT TYPE: THERMAL PASTE
• WEIGHT: 3 G
• THERMAL CONDUCTIVITY: 13.8 W/M-K
• PACKAGE TYPE: SYRINGE
• APPLICATION: CPU, GPU AND COMPATIBLE COOLING APPLICATIONS