HIGH THERMAL CONDUCTIVITY AND EFFICIENT COOLING: PRO'SKIT PTG1-1.5 THERMAL COMPOUND!
THE PRO'SKIT PTG1-1.5 THERMAL PASTE IS A HIGH-PERFORMANCE THERMAL INTERFACE MATERIAL DESIGNED FOR COMPUTER PROCESSORS (CPU), GRAPHICS CARDS (GPU), AND OTHER ELECTRONIC COMPONENTS. FEATURING A 4.5 W/M-K THERMAL CONDUCTIVITY RATING, IT QUICKLY TRANSFERS HEAT TO THE HEATSINK, KEEPING YOUR DEVICES COOLER AND RUNNING STABLY.
* HIGH THERMAL CONDUCTIVITY: 4.5 W/M-K RATING FILLS MICRO-GAPS BETWEEN PROCESSOR AND HEATSINK TO MAXIMIZE HEAT TRANSFER.
* EASY SYRINGE APPLICATION: CONVENIENT 1.5G SYRINGE DESIGN ALLOWS PRECISE, CLEAN, AND WASTEFREE APPLICATION.
* ELECTRICALLY NON-CONDUCTIVE: WILL NOT CAUSE SHORT CIRCUITS ON YOUR MOTHERBOARD OR HARDWARE COMPONENTS.